When Additional Processing Is Required

Our vast experience with laser machining has served our customers well throughout the years.  There are times, however, when additional processing steps are required to satisfy certain applications.  As a cost-savings, as well as a time-savings measure, we offer many additional process capabilities to our customers.

Our additional process capabilities include:

  • Annealing: Heat treatment of thick and thin film ceramic substrates to thermally modify the heat-affected zone (HAZ) allowing for improved via metal adhesion or, in some cases, to relieve residual stresses.
  • Clean Firing: Exposure to a Nominal Temperature in excess of 1100oC, but significantly less than the material’s defined sintering temperature, to remove possible organic based contamination.
  • Camber and Surface finish Verification: Should our customer require non-standard camber or surface finish, we are able to measure and sort through our available inventory upon request.
  • Diamond Dicing:  When tighter tolerances on length and width dimensions are required, dicing offers a tolerance as low as ± 0.0005" depending upon material size and thickness.  Dicing also offers a smooth, clean edge.
  • Surface Lapping & Polishing: Should our customer require non-standard as-fired finish, surface lapping and polishing is the solution for achieving the tightest tolerances and parallelism.  Please contact us with your specification requirements.
  • Edge Grinding: This process prepares surfaces for additional processing and/or smoothes or roughens surfaces to meet finishing requirements.
  • Bead Blasting: Abrasive particles and air are compressed and then forced through a nozzle which will provide a variety of finishes and deburring options
  Ceramic Specialty

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Secondary Processing
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Ceramic Definitions
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