Laser Services will exhibit at EDI CON 2016, the Electronic Design Innovation Conference, September 20-22, at the Hynes Convention Center in Boston, Massachusetts.
Conference attendees are invited to visit Laser Services at booth #107 to learn about the latest technology surrounding advanced laser ablation, cutting, drilling, scribing, etching, and welding for the microwave and RF industry.
“Manufacturing high-performance electronic circuits at high-yield while meeting extremely tight tolerances for purity, feature density, and cost often requires close collaboration between circuit designers and their laser processing partner,” says Greg Sexton, Laser Services’ CEO. “EDI CON offers an excellent opportunity for us to meet with members of the circuit design community so we can learn from each other.”
Laser Services has long been a leader in the application of laser processing technology to the fabrication of integrated circuits and their substrates. The company offers a complete line of these services from its fully equipped and stocked facility located in Westford, Massachusetts USA. For the RF and microwave industry they cut ceramic materials, frozen epoxies, and a variety of PCB substrates - stocking many brand name materials such as Coorstek, Ceramtec, and Kyocera for quick turn-around. Laser Services’ 16,000 square foot facility features 25 low to high power lasers and a variety of other state-of-the-art equipment and secondary processing tools.